TitleProduct

Laser Cutting/Machining Alumina Ceramic Substrates

  • Price:

    Negotiable

  • minimum:

  • Total supply:

  • Delivery term:

    The date of payment from buyers deliver within days

  • seat:

    Guangdong

  • Validity to:

    Long-term effective

  • Last update:

    2017-12-03 00:19

  • Browse the number:

    119

Send an inquiries
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Actech Precision Ceramics (HK) Limited
Contactaixin:

Mr. Benny Yin(Mr.)  

Email:

telephone:

Arrea:

Guangdong

Address:

17 Building, Xili Street Xili Industrial Zone, Nanshan District, Shenzhen, Guangdong, China 518055

Website:

http://actechceramic.ruixiangmc.com/

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Ceramic Substrates are used in many electronic applications where a thin insulating layer of thermally
stable material is required to conduct heat away from electronic components whilst electrically insulating
them, and material is 92%, 96%, 99%alumina, zirconia and ZTA.

Properties with excellent insulation, high mechanical strength, high thermal conductivity, low expansion
coefficient, small dielectric constant, high-temperature resistance, excellent erosion and wear resistance,
good quality in chemical shock heat and cold.

Supply alumina ceramic substrate:
Thickness: 0.3 - 2mm
Size: 10 - 300mm, According to drawing.

Laser Cutting ceramic substrate:
Cutting the highest accuracy: +/- 0.02mm
Cutting Maximum size: 152.4 x 152.4 mm
Cutting Minimum aperture diameter: 0.1mm
Cutting Maximum thickness: 1.5mm
 
Product Name
Ceramic Substrates
Material
Alumina, Zirconia and Silicon Nitride Ceramic
Color
Black and White
Size
10-300mm
Thickness 
0.3mm, 0.38mm, 0.5mm, 0.635mm,1mm, And According to drawings
Surface Roughness Ra0.2
Tolerance
+/-0.01mm
Lead time
15 - 30days
Max. Working 1500 -1700 °C
Samples
Avaliable
Shipping 
Air Express (DHL/UPS/TNT/ FedEx) or Ocean Shipping
 
Products Show:
Properties Units 96%
Al2O3
99%
Al2O3
Zirconia Silicon
Nitride
Machinable
Ceramic
Material Characteristics
Gas Permeability   0 0 0 0 0
Water Absorption % 0% 0% 0% 0% 0.038%
Colour   White Ivory White Grey White
Density g/cm3 3.7 3.85 6 3.2 2.7
Physical Characteristics
Hardness Kg/mm2 1100 1400 1100 1600 1175
Modulus of Elasticity Gpa 300 350 200 300 65
Flexural Strength Mpa 300 340 1150 600 108
Compressive Strength Mpa 2100 2200 2500 2500 488
Fracture Toughness Mpam1/2 3.5 4 12 6  
Thermodynamic Property
Max Use Temperature °C 1500 1650 1500 1800 800
Thermal Conductiviey W/(m.k) 25 27.5 2.5 20 1.68
Thermal Expansion Coefficient 10-6/°C 7.5 8 10 3.2 8.6
Thermal Shock Resistance △T°C 200 200 250 600 200
Specific Heat J/kg.K 860 860 500 500  
Electrical Specification
Dielectric Strength KV/mm 12 10 5   40
Dielectric Constant εr 9.5 9.1 12 6 7
Volume Resistivity Ω ≥1014 ≥1014 ≥1010 ≥1014 ≥1016
Dielectric Loss Angle   0.0002 0.0002 0.001    


Manufacturing Process


Packing and Shipping: